![]() ![]() This rigid PCB part was designed to be placed in the middle of the warning sign. Custom rigid PCB was designed to integrate radio link, PIR sensor and buzzer. Next the components needed to implement functionalities were selected and alerting LED module substrate, battery and solar cell layouts were designed. LEDs, solar cell and battery are assembled on these substrates. System PWBs will be a thin and flexible polymer substrates with silver ink printed conductors and bonding pads. Wireless connection to server is provided by a low energy radio network operating at 2.4 GHz ISM waveband. Energy harvesting will be provided by a flexible solar cell and harvested energy will be stored in a bendable battery. When the person is detected, combination of both visual and audible warning signals will be produced using blinking LEDs and a beeping buzzer in order to ensure excellent observation of the warning sign alert. From Figure 4 we can see that the sensing of person will be implemented using passive infrared (PIR) sensor. In the next phase preliminary design concepts to meet the targeted functionalities were created, see Figure 4. system needs to be as thin and flexible as possible to provide easy mounting of sign and minimise usage and weight of materials. system needs to have wireless connection to server proving up and down gateway to Internet. system needs to be autonomous meaning that connection to the grid is not needed and energy required for system operation is achieved by energy harvesting using solar cells and stored to energy reservoir, such as flexible battery. At the beginning of the design process target functionalities and requirements for intelligent warning system were listed as following: - system needs to be intelligent and active meaning that there need to be sensing of person and active warning of person using both visual and audible signals in addition to passive graphical warning information. In Figure 3 a red LED chip is bonded on silver ink printed contact area on polymer substrate. Non- conductive adhesive (NCA) can be used for mechanical attachment of components. Bonding of devices and components is performed using adhesives, such as isotropic conductive adhesive (ICA) and anisotropic conductive adhesive (ACA). EVO can pick-and-place bare dies, SMD components and flex components. When the assembly is finalised on the whole work area the roll is transferred 300 mm forward and halted again in sequential assembly process. Machine operates in stop-and-go mode so that assembly is performed on 200 mm (W) x 300 mm (L) work area on halted foil. Modern bonding machines, such as Datacon 2200 EVO pick-and-place bonding machine, allows fast and versatile device, component and flexible PWB bonding on FR4, LTCC, silicon and polymer substrates. ![]() ![]() Figure 2 Datacon 2200 EVO R2R pick-and-place assembly machine is shown. ![]()
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